1～12 item / All 12 items
Slicing Dicing Machine DLS-71/25
Are you struggling with cutting thick workpieces? The Dastec DLS-71/25 can cut workpieces up to a maximum size of 400×400. It can handle large sizes and thick workpieces, making it suitable for dicing any type of work. You can also rely on us for cutting thick raw ceramics!
Equipped with a high-power spindle! Precisely cuts thick workpieces up to 30mm!
The "DAS110" is a fully automatic slicing/dicing machine capable of cutting thick workpieces up to 30mm with high precision. It achieves a high throughput processing that surpasses conventional machines. It is compatible with workpieces such as neodymium magnets, ceramics, raw ceramics, various metals, and various types of glass. 【Features】 ■ Equipped with a high-power spindle ■ Capable of multi-blade cutting ■ Automatic θ-axis and automatic alignment as standard ■ Maximum work size: 200mm x 200mm ■ Multi-blade *For more details, please refer to the PDF materials or feel free to contact us.
Achieving rapid and stable production with 24-hour full operation! We have two in-house factories for prototypes and mass production.
Tokyo Electronic Industry has its own factories in Todak and Kasukabe, Saitama Prefecture. In recent years, it has specialized in the cutting and processing of ceramics and glass, enhancing its equipment and systems, including dicing machines, slicing machines, and clean rooms (at the headquarters factory), to support customers' advanced specifications, production quantities, and shortened delivery schedules. The headquarters factory focuses on a variety of products, while the Kasukabe factory specializes in mass production, thereby increasing production efficiency. 【Features】 ■ Over 100,000 cutting case studies at the headquarters and Kasukabe factories ■ Accumulated technology and know-how in ultra-precision processing and ultra-fine processing ■ Introduction of new equipment to meet the increasingly demanding customer requests ■ Establishment of a production system that integrates rich experience, processing equipment, and high technical capabilities ■ Ownership of approximately 100 processing machines to meet the needs for ultra-precision and fine processing *For more details, please refer to the PDF materials or feel free to contact us.
Dastec Slicing Dicing DAS110
Are you looking for an efficient cutting method? Dastec's high-rigidity machines offer "high performance"! We provide clean cutting processes and efficient cutting solutions. The DAS110 is capable of cutting thick workpieces as well. With automatic θ-axis and automatic alignment, operation is simple. Designed for safety and space-saving. We also accept custom design and manufacturing to meet your specific needs.
High-precision cutting of large and thick materials! Compatible with workpieces such as glass plates and metal plates!
The "DLS6160/6165" is a new model of fully automatic slicing/dicing machine developed for large-format and thick materials. It can cut with high precision even at a maximum size of 650×550mm and a thickness of 25mm. It is compatible with workpieces such as glass plates, metal plates, and ceramics. Additionally, it features automatic alignment and an operation panel, which improve processing accuracy and productivity. 【Features】 ■ A game changer for cutting large laminated glass ■ High precision cutting with multi-blade ■ High precision automatic rotation of the θ-axis ■ Maximum work size: 650mm×550mm *For more details, please refer to the PDF document or feel free to contact us.
How about cutting processing that can accurately cut not only width/depth/height but also right angles?
Cutting ceramics involves various requirements, including dimensions in the XYZ directions of width, depth, and height, as well as factors like perpendicularity. There are also various cutting methods, such as slicing, dicing, and laser cutting. Lead adopts the dicing method, which can comprehensively solve issues related to high finishing precision, variation control during mass production, and cost performance. Specifically, high finishing precision is achieved through image recognition, variation control during mass production is managed with NC control, and cost performance is ensured by utilizing mature technologies.
![[Processing Example] Fixed Pitch Cut](https://image.mono.ipros.com/public/product/image/a87/2000592230/IPROS56659030623071506259.png?w=280&h=280)
Dicing that can cut various materials with high precision!
Fixed pitch cut Material: Silicon wafer Work thickness: 0.7mm Cut width: 0.05mm
![[Processing Example] Multi-Size Cut](https://image.mono.ipros.com/public/product/image/54a/2000592241/IPROS67165984129151422282.png?w=280&h=280)
Dicing that can cut various materials with high precision!
Multi-size cut Material: Aluminum nitride Work thickness: 1.0mm Cut width: 0.1mm X direction: Fixed pitch Y direction: Multi-size pitch
![[Processing Example] Multi-Angle Cut](https://image.mono.ipros.com/public/product/image/008/2000592243/IPROS45352811176206579859.png?w=280&h=280)
High-precision dicing that can cut various materials!
Multi-angle cut Material: Aluminum nitride Work thickness: 1.0mm Cut width: 0.1mm
![[Processing Example] Full Cut](https://image.mono.ipros.com/public/product/image/f83/2000592244/IPROS56797084922677407157.png?w=280&h=280)
Dicing that can cut various materials with high precision!
Full cut Material: Aluminum nitride Work thickness: 1.0mm Cut width: 0.1mm
![[Processing Example] Half Cut](https://image.mono.ipros.com/public/product/image/4e8/2000592245/IPROS45800580001709181188.png?w=280&h=280)
Dicing that can cut various materials with high precision!
Half cut Material: Aluminum nitride Work thickness: 1.0mm Cut width: 0.1mm Groove depth: 0.5mm
![[Processing Example] Groove Cutting](https://image.mono.ipros.com/public/product/image/367/2000592246/IPROS06668770372251505854.png?w=280&h=280)
Dicing that can cut various materials with high precision!
Groove cut Material: Aluminum nitride Workpiece thickness: 1.0mm Groove depth: 0.5mm
